description the blue hlmp-ds25 and HLMP-NS30, and green hlmp-dm25 and hlmp-nm31 leds are designed in an industry standard t-1? and t-1 pack-ages with clear and nondifused optics. these lamps are ideal for use as indicators and for general purpose lighting. blue lamps ofer color diferentiation as blue is attractive and not widely available. features ? popular t-1? and t-1 diameter packages ? general purpose leads ? reliable and rugged ? binned for color and intensity ? bright ingan dice applications ? status indicators ? small message panel ? running and decorative lights for commercial use ? back lighting ? consumer audio package dimensions hlmp-ds25/dm25/ns30/nm31 t-1? (5 mm), t-1 (3 mm) ingan led lamps data sheet caution: devices are class 1c hbm esd sensitive per jedec standard. please observe appropriate precautions during handling and processing. for additional details, refer to application note an-1142. 6.10 (0.240) 5.59 (0.220) 23.0 (0.90) min. 0.45 (0.018) square nominal 2.54 (0.100) nom. cathode 1.27 (0.050) nom. 0.89 (0.035) 0.64 (0.025) 9.19 (0.352) 8.43 (0.332) 5.08 (0.200) 4.57 (0.180) notes: 1. all dimensions are in millimeters (inches). 2. epoxy meniscus may extend 1 mm (0.040") max down the leads. hlmp-ds25/dm25 23.0 min. 5.85 0.50 2.54 0.30 HLMP-NS30/nm31 4.40 0.30 3.10 0.20 3.50 0.30 1.0 min. 2.00 3.40 0.20 0.44 0.20 0.40 + 0.10 ? 0 cathode marks 0.45 + 0.10 ? 0.04 0.65 max.
2 part numbering system hlmp C x x xx C x x x xx mechanical option 00: bulk dd: ammo pack color bin options 0: full color bin distribution maximum iv bin options 0: open (no. max. limit) minimum iv bin options please refer to the iv bin table viewing angle 25: 25 degree 30/31: 30 degree color options s: blue m: green package options d: t-1? (5 mm) n: t-1 (3 mm) auto-insertable selection guide package description color part number luminous intensity iv (mcd) at 20 ma min. max. t-1 ? blue hlmp-ds25-f0000 110 C blue hlmp-ds25-f00dd 110 C green hlmp-dm25-j0000 240 C t-1 blue HLMP-NS30-j0000 240 C blue HLMP-NS30-j00dd 240 C green hlmp-nm31-r0000 1500 C green hlmp-nm31-r00dd 1500 C
3 absolute maximum ratings (t a = 25 c) parameter hlmp-ds25/dm25 HLMP-NS30/nm31 peak pulsed forward current [1] 100 ma 100 ma dc forward current [2] 30 ma 30 ma reverse voltage not recommended for reverse bias power dissipation 116 mw 116 mw led junction temperature 115 c 115 c operating temperature C40 to +85 c C40 to +85 c storage temperature C40 to +100 c C40 to +85 c notes: 1. duty factor = 10%, frequency = 1 khz. 2. derate linearly as shown in figure 4. optical characteristics (t a = 25 c) part number luminous intensity i v (mcd) @ i f = 20 ma min. color, dominant wavelength l d [1] (nm) typ. peak wavelength l peak (nm) typ. viewing angle 2 q 1/2 [2] degrees typ. hlmp-ds25 110 470 468 25 hlmp-dm25 240 527 520 25 HLMP-NS30 240 470 468 30 hlmp-nm31 1500 527 520 30 notes: 1. the dominant wavelength, l d , is derived from the cie chromaticity diagram and represents the single wavelength which defnes the color of the device. 2. q 1/2 is the of-axis angle at which the luminous intensity is half of the axial luminous intensity. electrical characteristics part number forward voltage v f (v) i f = 20 ma speed response t s (ns) capacitance c (pf), v f = 0, f = 1 mhz thermal resistance r q j-pin ( c/w) junction to cathode lead min. typ. max. typ. typ. hlmp-ds25 2.8 3.2 3.8 500 50 260 hlmp-dm25 2.8 3.2 3.8 500 50 260 HLMP-NS30 2.8 3.2 3.8 500 50 290 hlmp-nm31 2.8 3.2 3.8 500 50 290
4 0 5 10 15 20 25 30 0 1 2 3 4 forward voltage - v forward current - ma 0 1.8 0.6 relative luminous intensity (normalized at 20 ma) i f ? dc forward current ? ma 0 10 30 50 1.2 20 40 1.6 1.4 1.0 0.8 0.4 0.2 i f ? forward current ? ma dc 0 0 t a ? ambient temperature ? c 30 70 35 20 10 10 50 30 80 5 15 25 20 40 60 90 relative intensity 1.0 0 angular displacement ? degrees 0.8 0.6 0.2 -90 0.4 -50 -30 10 50 90 -10 30 -70 70 0.9 0.7 0.5 0.3 0.1 -80 -60 -40 -20 0 20 40 60 80 relative intensity 1.0 0 angular displacement ? degrees 0.8 0.6 0.2 -90 0.4 -50 -30 10 50 90 -10 30 -70 70 0.9 0.7 0.5 0.3 0.1 -80 -60 -40 -20 0 20 40 60 80 wavelength relative intensity 1.0 0.5 0 380 530 680 580 430 480 630 0.9 0.8 0.7 0.6 0.4 0.3 0.2 0.1 blue green figure 5. relative luminous intensity vs. angular displacement for hlmp-ds25 and hlmp-dm25 figure 6. relative luminous intensity vs. angular displacement for HLMP-NS30 and hlmp-nm31 figure 1. relative intensity vs. wavelength figure 2. forward current vs. forward voltage figure 3. relative luminous intensity vs. forward current figure 4. maximum forward current vs. ambient temperature based on t j max. = 115 c
5 tolerance for each minimum and maximum = 15%. mechanical option matrix mechanical option code defnition o0 bulk packaging, minimum increment 500 pcs/bag dd ammo pack, straight leads, minimum increment 2k pcs/pack all categories are established for classifcation of products. products may not be available in all categories. please contact your local avago representative for further clarifcation/information. bin limits intensity range (mcd) bin min. max. f 110.0 140.0 g 140.0 180.0 h 180.0 240.0 j 240.0 310.0 k 310.0 400.0 l 400.0 520.0 m 520.0 680.0 n 680.0 880.0 p 880.0 1150.0 q 1150.0 1500.0 r 1500.0 1900.0 s 1900.0 2500.0 t 2500.0 3200.0 u 3200.0 4200.0 color bin limits (nm at 20 ma) blue nm @ 20 ma bin id min. max. 1 460.0 464.0 2 464.0 468.0 3 468.0 472.0 4 472.0 476.0 5 476.0 480.0 green nm @ 20 ma bin id min. max. 1 520.0 524.0 2 524.0 528.0 3 528.0 532.0 4 532.0 536.0 5 536.0 540.0 tolerance for each bin limit will be 0.5 nm.
6 precautions lead forming ? the leads of an led lamp may be preformed or cut to length prior to insertion and soldering on pc board. ? for better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. ? if manual lead cutting is necessary, cut the leads after the soldering process. the solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into led package. this is highly recommended for hand solder operation, as the excess lead length also acts as small heat sink. soldering and handling ? care must be taken during pcb assembly and soldering process to prevent damage to the led component. ? led component may be efectively hand soldered to pcb. however, it is only recommended under unavoidable circumstances such as rework. the closest manual soldering distance of the soldering heat source (soldering irons tip) to the body is 1.59mm. soldering the led using soldering iron tip closer than 1.59mm might damage the led. ? esd precaution must be properly applied on the soldering station and personnel to prevent esd damage to the led component that is esd sensitive. do refer to avago application note an 1142 for details. the soldering iron used should have grounded tip to ensure electrostatic charge is properly grounded. ? recommended soldering condition: wave soldering [1, 2] manual solder dipping pre-heat temperature 105c max. C pre-heat time 60 sec max. C peak temperature 250c max. 260c max. dwell time 3 sec max. 5 sec max. notes: 1. these conditions refer to measurement with thermocouple mounted at the bottom of pcb. 2. to reduce thermal stress experienced by led, it is recommended that you use only bottom preheaters. 1.59 mm ? wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. customer is advised to perform daily check on the soldering profle to ensure that it is always conforming to recommended soldering conditions. notes: 1. pcb with diferent size and design (component density) will have diferent heat mass (heat capacity). this might cause a change in temperature experienced by the board if same wave soldering setting is used. so, it is recommended to re-calibrate the soldering profle again before loading a new type of pcb. 2. customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature does not exceed 250c and the solder contact time does not exceeding 3sec. over-stressing the led during soldering process might cause premature failure to the led due to delamination. ? any alignment fxture that is being applied during wave soldering should be loosely ftted and should not apply weight or force on led. non metal material is recommended as it will absorb less heat during wave soldering process. ? at elevated temperature, led is more susceptible to mechanical stress. therefore, pcb must allowed to cool down to room temperature prior to handling, which includes removal of alignment fxture or pallet. ? if pcb board contains both through hole (th) led and other surface mount components, it is recommended that surface mount components be soldered on the top side of the pcb. if surface mount need to be on the bottom side, these components should be soldered using refow soldering prior to insertion the th led. ? recommended pc board plated through holes (pth) size for led component leads: led component lead size diagonal plated through- hole diameter lead size (typ.) 0.45 0.45 mm (0.018 0.018 in.) 0.636 mm (0.025 in) 0.98 to 1.08 mm (0.039 to 0.043 in) dambar shear- of area (max.) 0.65 mm (0.026 in) 0.919 mm (0.036 in) lead size (typ.) 0.50 0.50 mm (0.020 0.020 in.) 0.707 mm (0.028 in) 1.05 to 1.15 mm (0.041 to 0.045 in) dambar shear- of area (max.) 0.70 mm (0.028 in) 0.99 mm (0.039 in) ? over-sizing the pth can lead to twisted led after clinching. on the other hand under sizing the pth can cause difculty inserting the th led. for more information about soldering and handling of th led lamps, refer to application note an5334.
7 example of wave soldering temperature profle for th led 250 200 150 100 50 time (seconds) preheat turbulent wave laminar hot air knife temperature (c) recommended solder: sn63 (leaded solder alloy) sac305 (lead-free solder alloy) flux: rosin ux solder bath temperature: 245 c 5 c (maximum peak temperature = 250 c) dwell time: 1.5 sec ? 3.0 sec (maximum = 3 sec) note: allow for board to be su ciently cooled to room temperature before you exert mechanical force. 0 10 20 30 40 50 60 70 80 90 100
for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies in the united states and other countries. data subject to change. copyright ? 2005-2014 avago technologies. all rights reserved. av02-1029en - august 20, 2014 (ii) avago baby label (only available on bulk packaging) (1p) ite m: part number (1t) lot: lot number lpn: (9d)mfg date: manufacturing date (p) customer item: (v) vendor id : deptid: made in: country of origin (q) qty: quantity cat: intensity bin bin: color bin (9d) date code: date code standard label ls0002 rohs compliant e3 max temp 250c (1p) part # : part number (1t) lot #: lot number (9d)mfg date: manufacturing date c/o: country of origin customer p/n: supplier code: quantity: packing quantity cat: intensity bin bin: color bin datecode: date code rohs compliant e3 max tem p 250c lam p s bab y label packing label (i) avago mother label: (available on packaging box of ammo pack and shipping box) (1p) ite m: part number (1t) lot: lot number lpn: (9d)mfg date: manufacturing date (p) customer item: (v) vendor id : deptid: made in: country of origin (q) qty: quantity cat: intensity bin bin: color bin (9d) date code: date code standard label ls0002 rohs compliant e3 max temp 250c (1p) part # : part number (1t) lot #: lot number (9d)mfg date: manufacturing date c/o: country of origin customer p/n: supplier code: quantity: packing quantity cat: intensity bin bin: color bin datecode: date code rohs compliant e3 max tem p 250c lam p s bab y label
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